Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using dic technique

In this study, rupture of notched SENT specimens fabricated from a novel leadfree solder alloy is investigated. The lead-free solder alloy, focused on in this study, is particularly used as interconnect material in power modules of electric vehicles. Its commercial denomination is InnoLot and it can be used in harsh environments thanks to its improved reliability.
Nội dung trích xuất từ tài liệu:
Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using dic technique