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Luminescence confocal microscopy of 3D components of photonic integrated circuits fabricated by two-photon photopolymerization
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Thông tin tài liệu:
Direct laser writing (DLW) lithography has been growing rapidly and is widely used for photonic integrated circuit (PIC) fabrication manufacturing in micro optics and photonics to fabricate 2D, 2.5D, and 3D components due to low cost, high precision and no need for mask exposure.
Nội dung trích xuất từ tài liệu:
Luminescence confocal microscopy of 3D components of photonic integrated circuits fabricated by two-photon photopolymerization
Nội dung trích xuất từ tài liệu:
Luminescence confocal microscopy of 3D components of photonic integrated circuits fabricated by two-photon photopolymerization
Tìm kiếm theo từ khóa liên quan:
Advanced materials and devices Photonics wire bond Direct laser writing 3D structure Consequent photopolymerizationTài liệu liên quan:
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